BGA Reballing Stencil Kit for Phone IC Chip Repair, Solder Paste Template Compatible with Soldering Stations
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Product details
| Management number | 218784832 | Release Date | 2026/05/03 | List Price | $4.23 | Model Number | 218784832 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
- MULTI SIZE: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
- The tin mesh solder template is made of premium stainless steel material, which is not easily damaged and good durability for long use.
- SATISFY DIFFERENT NEEDS: BGA stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
- The tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature, and it can improve performance and reliability.
- EASY TO CARRY: The stencil has a compact appearance and is easy to carry around and use.
| Display | lcd or led |
|---|---|
| Brand Name | Fafeicy |
| Unit Count | 1.0 Count |
| Manufacturer | Fafeicy |
| Model Number | Fafeicysdkbchr7q3 |
| Number of Channels | 1 |
| Included Components | 1 x BGA Reballing Stencil |
| Manufacturer Part Number | Fafeicysdkbchr7q3 |
| Upper Temperature Rating | 480 Degrees Celsius |
End Caps
Spot Welding Equipment
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